Self-constructed tree-shape high thermal conductivity nanosilver networks in epoxy.

نویسندگان

  • Kamyar Pashayi
  • Hafez Raeisi Fard
  • Fengyuan Lai
  • Sushumna Iruvanti
  • Joel Plawsky
  • Theodorian Borca-Tasciuc
چکیده

We report the formation of high aspect ratio nanoscale tree-shape silver networks in epoxy, at low temperatures (<150 °C) and atmospheric pressures, that are correlated to a ∼200 fold enhancement of thermal conductivity (κ) of the nanocomposite compared to the polymer matrix. The networks form through a three-step process comprising of self-assembly by diffusion limited aggregation of polyvinylpyrrolidone (PVP) coated nanoparticles, removal of PVP coating from the surface, and sintering of silver nanoparticles in high aspect ratio networked structures. Controlling self-assembly and sintering by carefully designed multistep temperature and time processing leads to κ of our silver nanocomposites that are up to 300% of the present state of the art polymer nanocomposites at similar volume fractions. Our investigation of the κ enhancements enabled by tree-shaped network nanocomposites provides a basis for the development of new polymer nanocomposites for thermal transport and storage applications.

برای دانلود متن کامل این مقاله و بیش از 32 میلیون مقاله دیگر ابتدا ثبت نام کنید

ثبت نام

اگر عضو سایت هستید لطفا وارد حساب کاربری خود شوید

منابع مشابه

Electrical and thermal conductivities of reduced graphene oxide/polystyrene composites

Articles you may be interested in Fabrication and mechanical characterization of graphene oxide-reinforced poly (acrylic acid)/gelatin composite hydrogels J. Investigation of thermal conductivity, viscosity, and electrical conductivity of graphene based nanofluids Thermal conductivity of composites with hybrid carbon nanotubes and graphene nanoplatelets Appl. High thermal conductivity epoxy-sil...

متن کامل

Nanostructured ion beam-modified Ge films for high capacity Li ion battery anodes

Related Articles Three-dimensional elemental mapping of hollow Fe2O3@SiO2 mesoporous spheres using scanning confocal electron microscopy Appl. Phys. Lett. 100, 213117 (2012) High thermal conductivity epoxy-silver composites based on self-constructed nanostructured metallic networks J. Appl. Phys. 111, 104310 (2012) Comment on “Advanced mechanical properties of graphene paper” [J. Appl. Phys. 10...

متن کامل

Effect of Nanosilver on Thermal and Mechanical Properties of Acrylic Base Complete Dentures

OBJECTIVE Polymethyl methacrylate (PMMA), widely used as a prosthodontic base, has many disadvantages, including a high thermal expansion coefficient and low thermal conductivity, a low elasticity coefficient, low impact strength and low resistance to fatigue. This study aimed to make an in vitro comparison of the thermal conductivity, compressive strength, and tensile strength of the acrylic b...

متن کامل

Does Addition of Silver Nanoparticles to Denture Base Resin Increase Its Thermal Conductivity?

  Objective: Studies have demonstrates that physical properties of denture base affect patient satisfaction and acceptance. Thermal conductivity is among the most important properties of denture base influencing the sense of taste and gingival health. The conventionally used acrylic resin has a low coefficient of thermal conductivity. This study aimed to improve the thermal conductivity of acry...

متن کامل

Development of AlN/Epoxy Composites with Enhanced Thermal Conductivity

AlN/epoxy composites with high thermal conductivity were successfully prepared by infiltrating epoxy into AlN porous ceramics which were fabricated by gelcasting of foaming method. The microstructure, mechanical, and thermal properties of the resulting composites were investigated. The compressive strengths of the AlN/epoxy composites were enhanced compared with the pure epoxy. The AlN/epoxy co...

متن کامل

ذخیره در منابع من


  با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید

برای دانلود متن کامل این مقاله و بیش از 32 میلیون مقاله دیگر ابتدا ثبت نام کنید

ثبت نام

اگر عضو سایت هستید لطفا وارد حساب کاربری خود شوید

عنوان ژورنال:
  • Nanoscale

دوره 6 8  شماره 

صفحات  -

تاریخ انتشار 2014